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| Product Guide F_1105W Series, Dome Lens Type AlInGaP SMT LED s Features * High brightness AllnGaP die material * Dome lens provides intensified narrow, bright beam * Available for both standard and reverse mounting * Wider operating temperature: -40 ~ +100C s Applications * High-beam indicator for automotive use * Backlighting for automotive dashboards * Indoor / outdoor full-color signboards s Outline Dimensions s Recommended Solder Pad at Surface Mount 1.55 0.6 1.6 0.3 Anode s Recommended Solder Pad at reverse mount 1.6 1.5 HOLE (1.6) 0.5 0.5 R0.8 0.6 Cathode Mark Polarity Mark Cathode PCB 2.3+0.05 Unit: mm Tolerance + 0.1 s Electro-Optical Characteristics Part No. Material Emitted Lens Color Color AlInGaP AlInGaP AlInGaP Red Orange Yellow (Ta=25C) Wavelength Peak p TYP. Dominant d TYP. Spectral Line Half Width TYP. IF Luminous Intensity IV MIN. TYP. IF Forward Voltage VF TYP. MAX. IF Reverse Viewing Current IR Angle MAX. VR (2 1/2) FR1105W FA1105W FY1105W 70 180 20 Water 70 200 20 Clear 70 180 20 mcd mA 635 609 592 626 605 590 nm 15 15 15 20 20 20 mA 1.9 1.9 1.9 V 2.4 2.4 2.4 20 20 20 mA 100 100 100 A 5 5 5 V Deg. 50 Units 1.5 2.1 + 0.05 (4.6) 3.2 1.6 (2) s Absolute Maximum Ratings Red-Orange Orange-Red FA 81 30 100 5 -40 to +100 -40 to +120 1.0 (DC) 3.33 (Pulse) Amber FY 81 30 100 5 (Ta=25C) Item Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Symbol Pd IF IFM VR Topr Tstg IF FR 81 30 100 5 Units mW mA mA V C C mA/C * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. s Taping Specifications 1.75 + 0.1 4+0.1 1.5 +0.1 0 (1.8) (0.25) for Reverse Mount Type s Taping Specifications 1.5 +0.1 0 (1.85) 1.75 +0.1 4+0.1 (0.25) Center Hole 8+0.2 for Standard Mount Type Quantity on tape: 2000 pieces per reel (0.5) (2.2) ( 1.1) 2 + 0.05 4+0.1 3.5 +0.05 8+0.2 ( 1.1) 2+0.05 4+0.1 3.5+0.05 (2.1) Quantity on tape: 2000 pieces per reel 2+0.5 21+0.8 Center Hole Cathode Center Hole (3.45) (3.5) 13+0.2 Direction to pull RR Cathode +1 60 -0 13+0.2 9+0.3 11.4+1 +0 180 3 s Operation Current Derating Chart (DC) Direction to pull TR s Precautions FR, FA, FY Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering: LED Surface Temperature C Operation Heating 240 Temperature rise: 5C/sec. Cooling: --5C/sec. s Spatial Distribution (X & Y) 150 120 Pre-heating 2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGF_1105W-0301 ~ 0 60 to 120 sec. 5 sec. max FR, FA, FY Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com |
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